In recent years, the global semiconductor industry has undergone rapid transformation, drawing widespread attention to chip technologies, manufacturing capabilities, and supply chain security. China’s domestic semiconductor sector has continued to make progress in chip design, wafer fabrication, key equipment, materials, packaging, and testing, while its capacity for independent innovation across the industrial chain has steadily strengthened.

In June 2021, an industry media outlet published a report titled “China-Made 14nm Chips Expected to Enter Mass Production by the End of Next Year.” Citing industry experts, the report stated that domestically produced 14nm chips were expected to achieve mass production by the end of 2022. It also noted that China had made phased breakthroughs in areas such as etching equipment, thin-film deposition equipment, back-end packaging, and certain key materials.

It should be clarified that the phrase “by the end of next year” in the report was based on the year 2021 and therefore referred to the end of 2022, not the current point in time.

14nm Industrialization Is More Than a Breakthrough in a Single Manufacturing Process

Chip manufacturing is a highly complex systems engineering undertaking. From chip design and wafer fabrication to semiconductor equipment, core materials, packaging, and testing, every stage can affect product performance, yield, cost, and delivery capability.

The significance of industrializing domestically produced 14nm chips therefore lies not only in progress made by a particular production line or manufacturing process, but also in the gradual development of coordinated capabilities across China’s semiconductor industrial chain.

Publicly available information shows that a report released by the People’s Government of Pudong New Area once listed SMIC’s 12-inch wafer project as a major manufacturing project and stated that its 14nm process had already achieved large-scale mass production.

This suggests that the industry discussion at the time about “domestic 14nm mass production” was more likely focused on further improving the localization of equipment, materials, processes, packaging, and supporting systems, rather than achieving 14nm chip production for the first time.

Moving from being able to manufacture chips to manufacturing them consistently, and ultimately building a commercially competitive industrial ecosystem, requires continued progress in product yield, reliability, cost control, production capacity, and supply chain coordination.

Only when all parts of the industrial chain advance together can technological achievements be transformed into stable, reliable products that can be delivered at scale.

Mature Process Technologies Still Hold Significant Industrial Value

In the semiconductor industry, advanced process nodes are not the only measure of value for all chip products. Different types of chips have different requirements for manufacturing processes, device structures, packaging formats, and reliability.

High-performance computing, communications, and complex system-on-chip products generally place greater emphasis on transistor density and computing power. By contrast, applications such as industrial control, automotive electronics, energy management, and power conversion place greater importance on voltage withstand capability, conduction efficiency, thermal performance, stability, and long-term reliability.

The development of China’s semiconductor industry therefore requires not only continued exploration of advanced process technologies, but also greater attention to mature processes, specialty processes, power devices, new semiconductor materials, and advanced packaging technologies.

The coordinated development of multiple technology pathways will make it possible to better meet the needs of different markets, including new energy vehicles, industrial automation, photovoltaic and energy storage systems, consumer electronics, and data centers.

Progress Across the Industrial Chain Creates New Momentum for Power Semiconductors

With the rapid growth of new energy vehicles, renewable power generation, energy storage systems, charging infrastructure, and industrial automation, market demand for highly efficient and reliable power semiconductor devices continues to increase.

Power semiconductor products such as MOSFETs, IGBTs, SiC devices, GaN devices, and SBDs perform critical functions including power conversion, power control, rectification, switching, and protection.

Their competitiveness depends not only on chip design, but also on wafer processes, key materials, packaging and thermal management, testing and validation, and quality management.

The attention given to the industrialization of domestically produced 14nm technology reflects the gradual shift of China’s semiconductor industry from isolated technological breakthroughs toward coordinated development across design, manufacturing, equipment, materials, packaging, and testing.

The continued strengthening of the industry’s foundational capabilities will also create more favorable conditions for power semiconductor companies to conduct research and development, upgrade products, and pursue application innovation.

Hertz: Committed to Technological Innovation and the Power Semiconductor Sector

Hertz has long focused on the research, development, and advancement of power semiconductor products, with key product areas including MOSFETs, IGBTs, SiC devices, GaN devices, and SBDs.

The company brings together professionals with expertise in semiconductor wafer design, device development, and packaging manufacturing. Driven by technological innovation and centered on product quality, Hertz continues to strengthen its full-process capabilities, from product design and process development to packaging, testing, and quality management.

In response to the accelerating development of China’s domestic semiconductor industrial chain, Hertz will continue to monitor advances in semiconductor manufacturing technologies, key materials, advanced packaging, and end-use markets.

The company will continuously improve product performance, reliability, and consistency, while actively promoting the application of power semiconductor products in new energy vehicles, photovoltaic and energy storage systems, industrial control, power management, and consumer electronics.

Hertz will also further strengthen technical exchanges and collaborative innovation with upstream and downstream partners across the industrial chain. Guided by customer needs, the company will continue to optimize its product portfolio and service capabilities, providing customers with efficient, stable, and reliable power semiconductor products and solutions.

Building the Future with Chips, Advancing through Innovation

The development of the semiconductor industry requires long-term investment and joint efforts across every part of the industrial chain.

From the advancement of 14nm manufacturing processes to continuing breakthroughs in third-generation semiconductor materials and power device technologies, China’s semiconductor industry is steadily accumulating technological expertise, professional talent, and industrialization experience.

Looking ahead, Hertz will continue to uphold its development philosophy of “Building the Future with Chips, Advancing through Innovation.”

The company will remain deeply committed to core power semiconductor technologies, continue strengthening quality and product innovation, and strive to build an internationally competitive power semiconductor brand, contributing to the high-quality development of China’s semiconductor industry.